Advanced Acoustic Imaging for Power Module and High-Reliability Component Inspection
Product Overview
The D9650Z™ C-SAM is a next-generation acoustic microscope system engineered to meet the precision inspection needs of power modules, semiconductors, and advanced packaging. Featuring patented WaterPlum scanning, Visual PolyGate technology, and Sonolytics 2 software, the D9650Z enables non-destructive, high-resolution analysis of internal structures with exceptional depth detail and image clarity.
It is optimized for inspecting IGBT modules, ceramic substrates, die attach, bond layer thickness, and wire bonds, with flexible configuration options for both production and laboratory environments. Whether you need detailed defect localization or quantitative acoustic analysis, the D9650Z is built to deliver reliable, reproducible results.
Key Features
- WaterPlume™ inverted scanning keeps top surface dry and free of contamination
- Visual PolyGate™ with Probing-Gate™ enables simultaneous depth-specific imaging
- C-Scan, A-Scan, B-Scan, and advanced analysis (LoBE, Q-BAM™, ASF™, FDI™, Thru-Scan™)
- Up to 268 MP resolution, 1 ns gates, and up to 230 MHz transducer support
- Quantitative imaging with DIA software, Mil-Std-883 Method 2030 pass/fail tools
- Dual WaterPlume configuration for simultaneous inspection of two modules
- VRM™ (Virtual Rescanning Mode) captures full A-scan data for post-scan analysis
- AIMM™ (Acoustic Impedance Measurement Module) for material property analysis
- Fast automated scanning with digital servo motor and 314 × 314 mm scan area
- Cleanroom-ready design with ESD-safe surfaces and easy loading
Specifications
| Feature | Specification |
|---|---|
| Scan Area | Up to 314 × 314 mm (12.4" × 12.4") |
| Transducer Frequency Range | Up to 230 MHz |
| Resolution | Up to 268 megapixels (16K) |
| Gain Control | 95 dB, 0.5 dB steps |
| Gate Width | As narrow as 1 ns |
| Scanning Modes | C-, A-, B-, Multi-, Surface-, Interface-, Bulk-, LoBE, Thru-Scan™, STaR™, Q-BAM™, FDI™, ASF™ |
| WaterPlume Scanning Area | Single: 308 × 112 mm; Dual: 155 × 112 mm |
| Water Management | Fill, drain, recirculation, overflow protection |
| Data Output Formats | JPG, GIF, BMP, TIF, PCX |
| Software | Sonolytics® 2 for Windows 10; Multi-language support |
| Power Requirements | 90–250 V AC, 50/60 Hz, 15 A |
| Air Requirement | 10 CFM @ 10 PSI for drying |
| Dimensions (L × W × H) | 1.89 m × 0.74 m × 1.58 m (74.5" × 29.0" × 61.9") |
| Cleanroom Compatibility | ISO cleanroom-ready, ESD safe |
Applications
Semiconductors & Microelectronics
- Layer-by-layer inspection of multi-die structures, substrates, and encapsulation
- Analysis of chip cracks, internal delamination, and voids
- Non-destructive failure analysis of flip chip and advanced packaging
Materials & R&D
- Analysis of material integrity, warpage, and bonding uniformity
- Research on acoustic impedance, density, and elastic modulus via AIM
Resources
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