Automated Wafer-Level Acoustic Imaging System
Product Overview
The AMI AW 300 CSAM is a cutting-edge, fully automated acoustic microscopy system specifically designed for wafer-level inspection. Engineered to meet the rigorous demands of advanced packaging, MEMS, chip-on-wafer, and bonded wafers, the AW 300 delivers sub-5 micron sensitivity with fast throughput and minimal operator intervention.
With dual non-immersion scanning stages, ultra-high-resolution transducers, and Waterfall™ technology, the system ensures contamination-free inspection. Intelligent automation, dual loadports, and an integrated drying station make it ideal for 24/7 cleanroom production environments, where precision, speed, and reliability are paramount.
Key Features
- <5 µm sensitivity for bond inspection, void detection, and delamination analysis
- Dual-stage, non-immersion scanning using Waterfall™ transducers reduces contamination
- 500 MHz bandwidth pulser/receiver supports transducers from 5 to 400 MHz
- Fully automated wafer analysis software with void detection and pass/fail criteria
- C-Scan, A-Scan, B-Scan, and advanced analysis modes including LOBE & Interface Scan
- Integrated EFEM with robotic wafer handling, wafer alignment, and drying functions
- Compatible with FOUP, FOSB, SMIF, and open cassette handling
- ISO 5/6 cleanroom compatible; SEMI compliant (SECS/GEM, E5, E30, E84, etc.)
- Real-time Digital Image Analysis with Mil-Std-883 Method 2030 and custom outputs
- Optional Modules: Thickness measurement, CSA™, ASF™, MEMS cavity seal, and µCT imaging
Specifications
| Feature | Specification |
|---|---|
| Transducer Frequency Range | 5 MHz – 400 MHz (typically >100 MHz for wafers) |
| Pulser/Receiver Bandwidth | 500 MHz |
| Sensitivity | Better than 5 µm |
| Scanning Type | Dual-stage non-immersion via Waterfall™ tech |
| Max Wafer Size | 300 mm (12") |
| Repeatability (X-Y Axis) | ±0.5 µm |
| Inspection Area Resolution | Up to 268 MP (16K) image capture |
| Scanning Modes | A-Scan, B-Scan, C-Scan, Surface, Bulk, LOBE |
| Image Analysis Software | DIA, void % calc, auto accept/reject, histogram |
| Wafer Loading | Manual or fully automated EFEM with 2 loadports |
| Facility Power | 200–240 V AC, 30 A, 50/60 Hz |
| Air Requirement | 1200 L/min @ 0.62 MPa (peak) |
| DI Water | 4 L/min @ 1.4–2.0 bar (SEMI F63) |
| Dimensions (Main System) | 0.91 × 1.73 × 1.73 m (AIM); 1.40 × 1.73 × 1.73 m (EFEM) |
| Cleanroom Rating | ISO 5 (Class 100) optional / ISO 6 standard |
| SEMI Compliance | SECS/GEM (E5, E30, E37.1, E87, E90, E94) |
Applications
Semiconductors & Advanced Packaging
- Bond quality analysis in wafer-level chip scale packaging (WLCSP)
- Chip-on-wafer and stacked die delamination detection
- Void characterization in TSVs, interposers, and 3D-IC structures
MEMS & Photonics
- Cavity seal inspection (CSA™ for MEMS and optical sensors
- Crack and void detection under overmold and encapsulation layers
- High-frequency imaging of thin films and layered microstructures
Resources
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