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The semiconductor industry includes the design and fabrication of semiconductors and semiconductor devices, such as transistors and integrated circuits.
The fabrication process normally divided into several steps, Wafer fabrication, frontend process, and backend process. It is highly sophisticated and the requirement if very stringent every step throughout the manufacturing processes.
Core Solutions
Advanced Analytical & Testing Equipment
X-ray Fluorescence | WDXRF & TXRF
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Single Crystal Electron Diffractometer | SC-ED
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Wafer Thickness Measurement
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Thermal Analysis Systems | TA
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Bond Tester
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X-ray Diffractometer | XRD
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Topography & Deformation Measurement
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Nanoprobing SEM Solution
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Advanced Imaging Equipment
X-ray Topography Imaging System
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Manual X-Ray Inspection
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Automated Optical Inspection Systems | AOI
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Automated X-Ray Inspection | AXI
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Optical & Portable Equipment
Wafer Surface Analysis, Surface Contamination Identification (cleanliness) Using Contact Angle Measurement
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Non Contact Full Wafer Thickness Scanning Metrology
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Critical Wafer Metrology For Very Thin Wafers, Bumped Wafers, Mounted Wafers
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Water Surface Analysis, Surface Contamination Identification (Cleanliness) Using Contact Angle Measurement
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XRF Coating Thickness Analyzer
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Sample Management Equipment
Automated and Stand Alone Scanning Acoustic Microscope
Automated and Standalone Scanning Acoustic Microscope (SAM) solution offers high-precision, non-destructive imaging for a variety of materials and components.
Fluid Dispensing Solution
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Plasma Treatment Systems
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Advanced Plasma Cleaning Systems
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